MOL
2549
1+ ¥1000002.00
BOCON
1000
1+ ¥1.00
SILICON
5500
1+ ¥1.00
NXP Semico...
5000
1+ ¥7.58
25+ ¥7.43
100+ ¥7.29
500+ ¥7.15
1000+ ¥6.94
SILICON
4
1+ ¥1000002.00
MACON
3000
1+ ¥12.00
SILICON
20
1+ 面议
ONsemicond...
15000
1+ 面议
Cherry Sem...
1803
1+ 面议
Rubycon
1200
1+ ¥0.50
SILICONIX
2900
1+ 面议
SILICON LA...
15
1+ ¥1.00
1.27mm 板对板卧贴公座(1.27mm SMC...KTS-915-NP 优势
其他连接器
Technicaldata:InsulatorMaterial:HighTemperature Thermoplastic,LCP,UL94V-0.ContactMaterial:Stampedandformed,PhosphorBronzeClipMaterial:Stampedandformed,BrassContactPlating:AuorPdNi+AuoverNickelClipPlating:MattSnoverNickelAir-andcreepagedistance:0.4mmInsulatorresistance:10000Megohmsmin.Dielectricwithstanding:AC500Vfor1Minute.OperatingTemperature:-55℃to+125℃.Max.processingTemp:230℃for30-60seconds. 260℃for10seconds
会员年限:20年
5000
1+ ¥1.00
FOXCONN
1980
1+ 面议