50000
1+ 面议
50000
1+ 面议
台湾
30000
1+ ¥0.10
0.80mm 高速 Mini-Edge Card ...KTS-873-NP 优势
其他连接器
TechnicalData:InsulatorMaterial:HighTemperatureThermoplastic,LCP,UL94V-0Contact:stampedandformed,BeCuPlating:AuorSnoverNickelCurrentRating:3.1A@30℃TemperatureRiseContactresistance:20milliohmsMax.Insulatorresistance:500Megohmsmin.Dielectricwithstanding:AC500Vfor1Minute.OperatingTemperature:-55℃to+125℃Max.processingTemp:230℃for30-60seconds.260℃for10seconds.Mateswith:1.57mmCard
会员年限:19年
5000
1+ ¥1.00
供应SD卡座连接器 SD卡座垫高1.8 外焊SD卡座垫高1.8 外焊 优势
卡座
MATERIAL:Insulator:LCP/ThermalPlastic,UL94V-0Contacts:PhosphorBronze/CopperAlloyShell:StainlessSteelGrounding:BrassCONTACTPLATING:Underplate:50μ”~100μ”NickelContactArea:1μ”~30μ”SelectiveGoldSolderTailsArea:100μ”Tin/Lead(BrightenTin)or100μ”~200μ”Tin/LeadFree(BrightenTin/MatteTin)ELECTRICAL:OperationVoltage:3.3VACMax.CurrentRating:0.5AContactResistance:1000OHMSMax.InsulationResistance:1000ohmsmin@500VDC.DielectricWithstandingVoltage:1000VAC/minuteOperatingTemperature:-20°Cto+85°CMatingCycles:10000Cycles,Springisnotbreaking
会员年限:19年
5000
1+ 面议
50000
1+ 面议
50000
1+ 面议
2000
1+ 面议
10000
1+ 面议
5000
1+ 面议
合资
5000
1+ 面议
JST
5000
1+ ¥1.50
钜航
5000
1+ 面议
供应MOLEX 47352-1001, TF卡插座473521001 优势
卡座
一般产品家族内存卡插座系列47352注解Push-PushTypeWithVSS(SupplyVoltageGround)DetectSwitch元件类型端部&弹出器(主机)概述microSDMemoryCardConnector产品名称microSD卡,TransFlash类型推-推型类型无物理卡片探测开关开电路数(已装入的)8电路数(最多的)8颜色-树脂黑色耐用性(插拔次数)-最多次数5,000EjectorButton否弹出器按钮端无进入角度90°角(侧面插入)插接极性是材料-金属不锈钢材料-接合处电镀金材料-终端电镀锡材料-树脂高温热塑型塑料PCB定位器否PCB安装面普通PCB保持力是包装形式卷上凹盒带状Pitch-MatingInterface1.09mm(.043")Pitch-TerminationInterface1.09mm(.043")端口1运行温度范围-20°Cto+85°C终端界面:类型表面贴装电气(PleasereviewtheProductSpecificationforspecificdetails.)每触点最大电流0.5A屏蔽的是电压-最大100VDC焊接处理数据工艺温度最高时的持续时间(秒)10无铅工艺能力可以回流焊(仅限SMT)工艺温度最高时的最大插接次数2最高加工温度C250
会员年限:19年
MOLEX
50000
1+ 面议
JST
20000
1+ 面议
卡座
Specification:WithstandingVoltage:500VACMaxfor1MinuteInsulationResistance:1000MΩVoltageRating:100VACCurrentRating:0.5AAC/DCMaxContactResistance:40MΩMaxInsertionCycles:1000TimesApplication:ForCompactFlashTypeIAndTypeIICardUseMaterial:1Insulator:ThermalPlasticUL94V-02Contact:CopperAlloy3ContactPlatingUnderplate:50u''-100u''NickelContactArea:5u''-30u''SelectiveGoldSolderTailsArea:100u''-200u''Tin/LeadFree(BrightenTin/MatteTin)
会员年限:19年
500000
1+ 面议
500000
1+ 面议